Principal Application Engineer
Irvine, CA, United States
- Experience
- 10–15 years
- Employment
- Full-time
- Work mode
- Onsite
- Salary
- Not disclosed
- Deadline
- Apply by 1 Nov 2026
- Posted
- 2025-10-06
Required skills
| Skill | Experience | Level |
|---|---|---|
| Chemical Engineering or Mechanical Engineering | 3+ years | Intermediate |
| Master’s or Ph.D. in Materials Science | 3+ years | Intermediate |
| Experience: 10+ years in semiconductor materials | 10+ years | Expert |
| Customer Application Engineering | 3+ years | Intermediate |
| Electronics Manufacturing / SMT Process | 3+ years | Intermediate |
| R&D Collaboration | 3+ years | Intermediate |
| Data Analysis | 3+ years | Intermediate |
| CAD / Simulation Software | 3+ years | Intermediate |
| Statistical Analysis Tools | 3+ years | Intermediate |
| Thermal Management Materials | 3+ years | Intermediate |
| Failure Analysis / Troubleshooting | 3+ years | Intermediate |
| Material Characterization | 3+ years | Intermediate |
| DOE (Design of Experiments) | 3+ years | Intermediate |
| Process Development | 3+ years | Intermediate |
| Adhesive Technologies | 3+ years | Intermediate |
| Semiconductor Packaging | 3+ years | Intermediate |
| Sintering Paste Expertise | 3+ years | Intermediate |
About the role
# Principal Application Engineer
Location: Irvine, CA (On-Site/Hybrid)
Salary: $120,000 – $155,000 / year
Employment Type: Full-Time | Manufacturing & Production
## About the Role
Henkel Adhesive Technologies — home to trusted brands like Loctite®, Persil®, and Schwarzkopf® — is seeking a Principal Application Engineer to lead the company’s sintering paste programs and electronics materials initiatives.
This role is ideal for an engineering professional with deep expertise in semiconductor packaging, adhesives, and process optimization, who can bridge R&D and real-world customer applications.
## ⚙️ Key Responsibilities
* Lead all technical engineering efforts for sintering paste and adhesive material programs.
* Collaborate with global customers to troubleshoot and optimize material performance.
* Design and execute process development and DOE experiments.
* Develop and validate new application methods for customer success.
* Analyze data and performance metrics to improve product reliability and cost efficiency.
* Serve as a technical liaison between customers, R&D, and product management.
## Qualifications
✅ Education: Master’s or higher in Materials Science, Mechanical, or Chemical Engineering.
✅ Experience: 10+ years in semiconductor materials or packaging applications.
✅ Expertise:
* Semiconductor power packaging & thermal adhesives (sintering experience a plus)
* Process development, material characterization, DOE/statistical tools
* Customer-facing technical support & troubleshooting
✅ Soft Skills: Strong communicator, detail-oriented, independent, and collaborative.
✅ Travel: Up to 10 percent.
## Perks & Benefits
* Health, dental, and vision insurance (Day 1 eligibility)
* Paid time off, holidays, and flexible hybrid work
* 401(k) with company match + employee stock plan
* Parental leave, adoption/surrogacy reimbursement, and child-care discounts
* International career development opportunities
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